L'ultima evoluzione della famiglia Pentium, potenza, stabilità e prezzo contenuto.
Versione Box con ventola certificata Intel all'interno della confezione.
Caratteristiche:
Type CPU / Microprocessor
Family Intel Pentium Dual-Core
Model number E6300
CPU part number AT80571PH0722ML (QLPZ, SLGU9)
Box part number BX80571E6300 (SLGU9)
Frequency (MHz) 2800
Bus speed (MHz) 1066
Clock multiplier 10.5
Package 775-pin Flip Chip Land Grid Array (FC-LGA8)
1.48" x 1.48" (3.75 cm x 3.75 cm)
Socket Socket 775 (LGA775)
Introduction date May 10, 2009
Architecture / Microarchitecture
Core stepping R0 (SLGU9)
Manufacturing process 0.045 micron
Data width 64 bit
Number of cores 2
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size shared 2 MB
Features MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
EM64T technology
Execute Disable Bit
Virtualization technology
Low power features Halt mode
Extended Halt mode
Stop Grant mode
Extended Stop Grant mode
Sleep mode
Deep Sleep mode
Deeper Sleep mode
Enhanced SpeedStep technology
Electrical/Thermal parameters
V core (V) 0.85 - 1.3625
Minimum/Maximum operating temperature (°C) 5 - 74.1
Minimum/Maximum power dissipation (W) 8 (TDP for Enhanced HALT mode) / 98.89
Thermal Design Power (W) 65
Versione Box con ventola certificata Intel all'interno della confezione.
Caratteristiche:
Type CPU / Microprocessor
Family Intel Pentium Dual-Core
Model number E6300
CPU part number AT80571PH0722ML (QLPZ, SLGU9)
Box part number BX80571E6300 (SLGU9)
Frequency (MHz) 2800
Bus speed (MHz) 1066
Clock multiplier 10.5
Package 775-pin Flip Chip Land Grid Array (FC-LGA8)
1.48" x 1.48" (3.75 cm x 3.75 cm)
Socket Socket 775 (LGA775)
Introduction date May 10, 2009
Architecture / Microarchitecture
Core stepping R0 (SLGU9)
Manufacturing process 0.045 micron
Data width 64 bit
Number of cores 2
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB instruction caches
2 x 32 KB data caches
Level 2 cache size shared 2 MB
Features MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
EM64T technology
Execute Disable Bit
Virtualization technology
Low power features Halt mode
Extended Halt mode
Stop Grant mode
Extended Stop Grant mode
Sleep mode
Deep Sleep mode
Deeper Sleep mode
Enhanced SpeedStep technology
Electrical/Thermal parameters
V core (V) 0.85 - 1.3625
Minimum/Maximum operating temperature (°C) 5 - 74.1
Minimum/Maximum power dissipation (W) 8 (TDP for Enhanced HALT mode) / 98.89
Thermal Design Power (W) 65
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